Viewer-Mail Ep8: This CPU Unsoldered and Killed itself
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Channel: der8auer EN
Views: 105,004
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Id: 34VbutE-Qss
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Length: 16min 13sec (973 seconds)
Published: Sun Apr 02 2023
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If Der8auer sends that solder to a chemical analysis lab and confirms that the solder wasn't contaminated with something that made it melt at very low temps, I would be VERY curious of how the CPU reached 160C to melt the solder. Especially when the CPU owner claimed they didn't overclock other than using an EPXO profile.
Maybe a power/thermal circuit failure that lead to the CPU burning itself out? That would require opening up the die and running something like an electron microscope to compare that CPU's circuit to a known good one.
What is interesting is that the CPUs and boards he tested show that Zen 4 will happily run up to ~110C even if they were set with a 95C limit, before shutting down. Now if AMD claims that 110C region is safe for use, someone should ask Linus to build a passive boiling water loop (and a built-in tea/coffee maker) to cool the CPU at 105C for sustained usage just to see how long that CPU can run before failing.
Everyone is quick to propose theories of various places where AMD could've screwed up but, and I'm just saying, we can't deny the possibility of a failed delidding attempt from the owner - they could've applied too much heat, gave up, realized they borked the CPU but failed to admit their own mistake or simply connect the dots between it failing and their actions.
Oh shit, that testing does point to possibly malfunctioning thermal protection
There's so many temp sensors in the die that a failure of one would not defeat a CPU's thermal protection in of itself. So let me posit a different theory.
This is a 7900X, so one of the CCDs has half the cores disabled. Could the hot spot that melted the solder have been in the fused off section? Whether that was from a problem with the fusing process not completing correctly or some other internal circuit issue that still shorted to active silicon elsewhere in the die? Or even a BGA short to the fused portion of the CCD underneath.
My thinking is if the overheating occurred in the "dead" part of the CCD then there wouldn't be any thermal protection or anything else, it would just run short and keep generating heat until it melted the solder and eventually damaged the rest of the die and/or solder connections.
The only way you're melting solder is if there's a short circuit and even then I'm highly skeptical the motherboard can put out nearly enough power to melt that much solder with a cooler on. My bet is a failed delidding attempt in a toaster.